Endevco Corporation* licensed three silicon carbide (SiC) microelectromechanical systems (MEMS) patents that will enable it to jump start a new line of high-temperature, harsh-environment pressure sensors. NASA will be able to reduce costs and save development time by purchasing Endevco’s finished product for use in aeronautic, space, and planetary missions.

The technologies include a MEMS packaging technique and chip fabrication methods that were developed by a team led by Dr. Robert Okojie for use in aircraft engine combustion chambers. SiC pressure sensors manufactured using these new processes can be used to improve testing of jet engines, in deep well drilling, and in automobile combustion cylinders.

Developed with support from both the Aviation Safety and the Fundamental Aeronautics Programs of NASA, these sensors are anticipated for use in the Subsonic, Supersonic, and Hypersonic Projects under the Fundamental Aeronautics Program as well as potential future missions to Venus.

“The significant advantages of this innovation are very exciting,” said Endevco President Scott Silcock. “We are in the process of transferring the NASA SiC process into our MEMS manufacturing operation in Sunnyvale, with product availability for field testing in high-temperature applications targeted for late 2008. We have also formed partnerships with companies that have an immediate need for this breakthrough technology.”